China, Sept. 12 -- China based Inspur has secured contract from Ningbo Dabashou ecological Digital Technology Co., Ltd. for Procurement of 0733-251250916530 China Plastic Waste Reduction Project Integ... Read More
China, Sept. 12 -- China based Zehua ChemTec International Ltd., has secured contract from Petrochina Lubricant Company for Procurement of 0720-2540zbzx0095/03 ADDITIVE(2). The value of the contract i... Read More
China, Sept. 12 -- China based ROCK CHEMICAL TRADE(SHENZHEN)CO.,LTD. has secured contract from Petrochina Lubricant Company for Procurement of 0720-2540zbzx0095/05 ADDITIVE(2). The value of the contra... Read More
China, Sept. 12 -- China based ROCK CHEMICAL TRADE(SHENZHEN)CO.,LTD. has secured contract from Petrochina Lubricant Company for Procurement of 0720-2540zbzx0095/06 ADDITIVE(2). The value of the contra... Read More
China, Sept. 12 -- China based ROCK CHEMICAL TRADE(SHENZHEN)CO.,LTD. has secured contract from Petrochina Lubricant Company for Procurement of 0720-2540zbzx0095/07 ADDITIVE(2). The value of the contra... Read More
China, Sept. 12 -- China based Besi Singapore Pte. Ltd. has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124127 Flip Chip BonderEquipmen(2). The value of the contra... Read More
China, Sept. 12 -- China based SEMIGEAR, INC. has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124125 Wafer Level Reflow Equipment(2). The value of the contract is ... Read More
China, Sept. 12 -- China based BEIJNG CAPCON LIMITED has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124124 Wafer Level Flip Chip Bonder Equipment(2). The value of... Read More
China, Sept. 12 -- China based Suzhou Diruo Xing Technology Co., Ltd. has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124126 Wafer Level FC & Reflow connector ... Read More
China, Sept. 12 -- China based BEIJNG CAPCON LIMITED has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124123 Wafer Level Flip Chip Bonder Equipment(without IPD func... Read More